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AUTOMATICALLY REPLENISHED ELECTROLESS COPPER.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 5; PP. 26-28Article

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COPPER PLATING ADVANCED MULTILAYER BOARDS.ALPAUGH WA; MCCREARY JM.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 3; PP. 27-32Article

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A MODIFIED ELECTROLESS METHOD FOR THE FABRICATION OF MICROSTRIP LINES ON ALUMINA SUBSTRATES.SESHADRI TK; MAHAPATRA S.1977; INTERNATION. J. ELECTRON.; G.B.; DA. 1977; VOL. 43; NO 5; PP. 461-464; BIBL. 4 REF.Article

CHARACTERISTICS OF METAL-SEMICONDUCTOR CONTACTS FABRICATED BY THE ELECTROLESS DEPOSITION METHODDATTA AK; GHOSH K; CHOWDHURY NKD et al.1980; SOLID-STATE ELECTRON.; GBR; DA. 1980; VOL. 23; NO 8; PP. 905-907; BIBL. 8 REF.Article

THIN-FILM FORMATIONVOSSEN JL; KERN W.1980; PHYS. TODAY; ISSN 0031-9228; USA; DA. 1980; VOL. 33; NO 5; PP. 26-33; BIBL. 16 REF.Article

THE FABRICATION OF SCHOTTKY-BARRIER SOLAR CELLS BY ELECTROLESS NICKEL PLATINGLUE JT.1979; APPL. PHYS. LETTERS; USA; DA. 1979; VOL. 34; NO 10; PP. 688-690; BIBL. 15 REF.Article

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